The EK720 thermal pads are designed to conduct heat away from microchips to be dissipated through a heat sink. Replace aging and low-quality interfaces for increased thermal performance on chip components in laptops, graphics cards, game consoles, or in other electronics.
|Thermal Impedance||0.8 ℃·cm²/W|
|Thermal Conductivity||6.0 W/m·K|
|Specific Gravity(25℃)||3.4±0.2 g/cc|
|Operating Temperature||-40°C to +200°C|